ZEISS has presented a new generation of focused ion beam scanning electron microscopes (FIB-SEMs) for high-end applications in research and industry.
The ZEISS Crossbeam 550 features a significant increase in resolution for imaging and material characterisation and a speed gain in sample preparation. Nanostructures such as composites, metals, biomaterials or semiconductors can be investigated with analytical and imaging methods in parallel.
The scanning electron microscope allows simultaneous modification and monitoring of samples, resulting in fast sample preparation and high throughput, e.g. for cross-sectioning, TEM lamella preparation or nano-patterning.
It provides best image quality in 2D and 3D. The new Tandem decel mode enables enhanced resolution together with a maximisation of image contrast at low landing energies. The pioneering Gemini II electron optics delivers optimum resolution at low voltage and high probe current simultaneously.
The FIB column combines the highest available FIB current of 100 nA with the new FastMill mode, allowing for highly precise and more efficient material processing and imaging in parallel. Additionally, the new process for automated emission recovery increases the user-friendliness and optimizes the FIB column for reproducible results during long-term experiments.
With its enhanced resolution at low voltages and an outstanding stability for long-term 3D tomography the ZEISS Crossbeam 550 is ideal for use in the life sciences. Moreover, it is possible to optimally integrate the new workstation into correlative workflows and to combine it with light, X-ray or ion beam microscopy.
Material scientists profit from excellent 3D analytical properties, especially thanks to a new, fully integrated module for 3D EDS analyses with ZEISS Atlas 5.
Crossbeam 550 replaces its predecessor Crossbeam 540 and is available in a variation with a large chamber for the first time.
Selected product features can be upgraded for existing ZEISS Crossbeam 540 owners.