Shipley opens advanced facility
Shipley Company has opened its Advanced Technology Center (ATC) in the US, a state-of-the-art facility dedicated to the development of lithography, interconnect, low-k dielectric and "other critical materials needed to produce the newest generations of microelectronic devices".
Shipley, a subsidiary of Rohm and Haas, has invested €30 million in the facility at Marlborough, Massachusetts. The 65,000ft2 ATC building represents the first phase of Shipley's plans for the center. Initial ATC programmes are focused on the fast-cycle development of new 193nm photoresists and anti-reflectant coatings used in photolithographic processes. Additional programmes are expected to focus on the continued development and integration of low-k dielectrics, copper interconnect and later generation lithography materials supporting 157nm, extreme ultraviolet (EUV) and e-beam technologies. The ATC's Class I cleanroom is said to be home to one of the industry's most advanced 193nm exposure systems and the latest in track technology. The new building also includes a comprehensive metrology and modelling facility.