SEZ America launches US 300mm lab

Published: 28-Jun-2002


The Austrian company SEZ have opened its first 300mm applications lab in the US. Located in Phoenix, Arizonia, the 3000 square foot lab will be a resource for SEZ and its customers and partners to test 300mm wafer cleaning processes. Currently running three-four demos per week, the company is primarily testing customer wafers for stress relief, polymer removal and wafer thinning. Additional capabilities include backside film removal for pre-litho yield enhancement, backside and bevel clean for Cu decontamination and frontside polymer clean for metal line, via holes and Cu dual damascene technologies. The lab has complete 300mm capability, featuring 1253 square feet of class 10 cleanroom space and currently houses 20 pieces of process equipment. The facility incorporates SEZ's spin-processors 101, 203, 303 and the 1300 will be installed in May. "300mm is here, and the ability to provide complete 300mm testing capability is still a rarity," stated Jim Mello, vice president of operations at SEZ America. "This lab will give our customers and technology partners an edge in turn around time, with more valuable and timely data, and will greatly speed customers' development and introduction of faster, more powerful chips."

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