Intel converts to 300mm technology

Published: 12-Mar-2003


Intel Corporation plans to convert Fab 12, a 200mm wafer fabrication facility in Chandler, Arizona, US, to a 300mm wafer fab.

The conversion project, estimated to cost €2 billion, will begin in the first half of 2004 with production on 65nm process technology due to start up in late 2005. When completed, Fab 12 will become Intel's fifth 300mm wafer facility. Two other 300mm facilities are under construction – one in Oregon will begin operation later this year and another in Ireland is due to start production in the first half of 2004.

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