FPT opens trial operations at semiconductor testing plant in Vietnam

The Vietnamese technology company has a 1,600 sqm facility in Bac Ninh that features a Class 10,000 cleanroom, six production lines and a designed annual capacity of up to 300 million chips

FPT Corporation has begun trial operations at its semiconductor chip testing and packaging plant in Bac Ninh, Vietnam, featuring a Class 10,000 cleanroom and six production lines.

Located in Yen Phong II-C Industrial Park, the 1,600 sqm facility is operated by FPT Analysis Technologies Joint Stock Company and has a designed capacity of up to 300 million chips annually during the trial operations phase.

The testing area operates within a Class 10,000 cleanroom, equivalent to ISO Class 7, with environmental controls designed to limit airborne particle contamination.

FPT said the facility operates under internationally recognised management standards, including ISO 9001 for quality management processes, ISO 14001 for environmental management and ISO 45001 for occupational health and safety.

Semiconductor testing capabilities

The plant uses Automated Test Equipment (ATE) alongside Handler equipment to assess chip functionality and operational performance. 

The systems position individual components for testing and sort them according to whether they pass or fail.

FPT's engineering team develops customised test programmes for different chip products, with testing parameters determined by individual technical requirements.

Reliability assessments include testing under high-temperature conditions, temperature variations and combined temperature and humidity conditions to identify potential product failures.

During the initial operating phase, the facility will focus on chip functionality, quality and reliability testing for domestic and international semiconductor businesses. 

FPT expects to undertake its first chip testing order for a South Korean partner as it moves towards commercial operations.

The company also plans to work with FPT Polytechnic College on a practical semiconductor training programme, expected to begin in December 2026.

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