Micron Technology has commenced construction on a next-generation advanced wafer fabrication facility in Singapore, a $24bn investment aimed at expanding global NAND flash production capacity.
The new fab, located within Micron’s established NAND manufacturing campus, is designed to support high-volume production of advanced NAND memory to serve surging demand from artificial intelligence, data centre, and storage applications.
NAND is a type of flash memory used in solid-state drives, USB drives, and other storage devices to retain data without power.
Once completed, the fab will become Singapore’s first double-storey wafer fabrication plant, and will encompass 700,000 sqft of cleanroom space.
Construction is underway with wafer output slated to begin in the second half of 2028.
How the move will bolster R&D goals
The expansion reinforces Micron’s strategy of co-locating R&D, advanced packaging and wafer production.
The wafer fab alone is expected to generate about 1,600 new jobs in engineering, operations and automation roles.
The fab is being constructed with advanced automation and AI-assisted process systems to drive yield and throughput.
It will house cleanrooms precisely controlled for particulate levels, temperature, and humidity to support photolithography, etching, deposition, and other critical front-end processes.
“This investment solidifies Micron’s long-term commitment to Singapore as a critical hub in our global manufacturing network,” said Manish Bhatia, Executive Vice President of Global Operations at Micron.
Earlier this month, the company signed a $1.8bn letter of intent to acquire a fabrication site in Taiwan, adding an established 300,000 sqft cleanroom facility to accelerate DRAM wafer production from 2027.
Sustainability and industry impact
The project is being designed to meet leadership in energy and environmental design standards.
The facility is planned to comply with LEED standards and include programs for greenhouse gas reduction, water recycling, and waste minimisation.