Remtec, a US-based provider of ceramic-based packaging, assemblies, substrates, and components applied across the electronics industry, has completed its new, 55,000 sqft facility in Canton, Massachusetts, US.
Hodess Cleanroom Construction, a US-based cleanroom construction specialist, was contracted by Remtec to design and build a 10,000 sqft, ISO Class 8 cleanroom for the new facility.
Remtec celebrated the opening of the new facility with an official ribbon-cutting, open house, and tours for elected officials and other stakeholders in late spring.
With an investment of more than US$12m in the project, Remtec indicates that the move will result in increased capacity, new manufacturing and process capabilities, and increased vertical integration.
Remtec’s President, Brian Buyea, said: "This new and far more modernised facility doubles the footprint of the Norwood facility we’ve called home since our founding in 1992.
The project consisted of design and build a 10,000 sqft, ISO Class 8 cleanroom for the new facility
"In turn, the larger physical space allows us to expand capabilities that add value and electronics content for our customers; allows us to vertically and more cost-effectively integrate some of the processes we previously outsourced; and increases capacity for both incoming materials and completed products, so we can ship on demand," Buyea adds.
"It even gives us more space for engineering, collaboration, and back-office functions – which makes us more competitive and is also resulting in a nice boost in employee morale."
Remtec is most known for the design and manufacturer of thick film, direct bond copper substrates and packaging products for the electronics industry.
According to Buyea, new capabilities that directly result from the move — and likely to be attractive to the company’s customers in the re-energized domestic electronics market include:
- Increased capacity and processing speeds for Remtec’s existing, proprietary solutions — such as thick film ceramic boards/substrates (BeO, AIN, AI203); Plating (AU, AG, ENIG); Direct Bond Copper; and Plated Copper Thick Film (registered trademark) (PCTF)
- Advanced dicing and laser trimming systems – to meet ever-more exacting tolerance requirements of Remtec’s resistive components customers
- Photoimaging, laser etching, laser ablation and like systems – for more precise lines, through-holes, alignment marks, slots, flats, and chamfer cuts and other complex shapes and features needed for demanding end-applications
- An array of other new manufacturing infrastructure and process capabilities – that empower Remtec to develop and produce vastly more complex products, structures, and electronic content (not just board and substrates) — such as whole electronic packages, complex assemblies, embedded and printed components, and multilayer circuits solutions.
Top image: Remtec's new facility