The Fraunhofer Institute for Photonic Microsystems IPMS, based in Dresden, Germany, has partnered with DIVE imaging systems to install an optical measurement system.
The new system is aimed at streamlining semiconductor manufacturing and reducing environmental impact.
DIVE imaging systems, a German-based inspection equipment manufacturer, develops advanced optical tools for semiconductor applications.
Installed at the Fraunhofer IPMS cleanroom, the new system from DIVE significantly reduces the effort required for quality control during wafer production.
The collaboration forms part of the "NEST" project (New Screening Tool for Efficient Semiconductor Manufacturing), which seeks to improve resource efficiency in a process that can involve up to 1,500 production steps.
The integration of AI algorithms further enhances process control, while reducing overall testing demands
Semiconductor wafers must be virtually defect-free due to the complexity of integrated structures.
As a result, nearly half of all process steps in semiconductor manufacturing are related to metrology, including the use of thousands of additional control wafers each month.
This intensive quality assurance process consumes considerable energy, time, and raw materials.
To address this challenge, DIVE and Fraunhofer IPMS, alongside Fraunhofer IZM, conducted a joint environmental potential analysis over 18 months.
Semiconductor wafers must be virtually defect-free due to the complexity of integrated structures
The findings show that using targeted inspection tools could reduce control wafer usage by at least 25% and avoid more than 118,000 kg of CO₂ emissions per month.
These projections are based on a 28 nm manufacturing process and 25,000 wafer starts per month.
The research was funded by the “Green ICT Space” programme under the Research Fab Microelectronics Germany (FMD).
DIVE’s proprietary solution combines spectroscopy and imaging technologies to identify defects, even in deeper wafer layers, offering significant environmental and economic benefits.
The partners also plan further development projects to integrate wafer handling automation and automatic data transfer into the system
These include reduced water and chemical use, lower energy demand due to fewer metrology steps, and enhanced yield from early process deviation detection.
DIVE’s VEpioneer (trademarked) platform, the first system of its kind designed for industrial cleanroom environments, can assess wafer surfaces, contamination, and process deviations in just 20 seconds.
The integration of AI algorithms further enhances process control while reducing overall testing demands.
Martin Landgraf, R&D Manager at Fraunhofer IPMS, said: “DIVE's hyperspectral imaging systems offer a new way of non-destructive wafer inspection.
“With the support of Fraunhofer IPMS, this innovative technology is now available for use in standardised industrial cleanrooms – enabling significant productivity gains and cost savings for semiconductor fabs.”
Following the successful conclusion of the project, the VEpioneer system will remain at Fraunhofer IPMS’s Center for Nanoelectronic Technologies (CNT) for continued wafer inspection and customer evaluation.
The partners also plan further development projects to integrate wafer handling automation and automatic data transfer into the system.
DIVE was recently acquired by German semiconductor metrology specialist PVA TePla AG, creating further opportunities to advance the technology and expand its deployment across the semiconductor manufacturing sector.
Top image: Experts from DIVE and Fraunhofer IPMS in the cleanroom at Fraunhofer IPMS in Dresden
