Point-of-use filtration

Published: 11-Sep-2003

Paul Vannerem of Donaldson Europe demonstrates a cost-effective solution to challenges in the semiconductor industry


The negative affect on yield rates and tool uptime of acidic, basic and organic molecules in the gas phase is receiving increasing attention within the semiconductor industry. While in deep ultra violet (DUV) lithography, the filtration of resist-poisoning amines has been carried out for a number of years, newer concerns also include the degradation of optics, chemical contamination of reticles, changes in resist sensitivity etc. This all contributes to the evolution of air and gas purity requirements within exposure tools. In other areas, such as mask making, the use of chemical filtration has also become necessary due to the implementation of chemically amplified resists (CAR) and DUV wavelengths. Using a controlled environment at the point-of-use, the OEM or the toolowner can specify the type of environment required locally. This offers benefits in terms of tool uptime and yield rates, and also, by limiting the size of this environment, the operation costs can be substantially reduced. The advantages of point-of-use filtration are numerous:

  • The supply of high purity air or gas is restricted to the targeted critical area.
  • Adapted solutions can be developed for existing designs, making it an ideal tool for retrofit situations.
  • Cost of ownership is significantly reduced, since the flow with the tightest specifications is reduced to a minimum.
  • Maintenance is spaced out, since a reduced flow also means an increased filter lifetime.
Point-of-use solutions can be developed at different scales: for process air inside lithography tools, typical airflows will be in the range of 300 to 3,000m2/hour, for compressed air or N2, around 100 litres per minute. For breather applications with a limited flow in function of temperature and pressure fluctuations, passive-adsorptive filters can be used. For both economical and technical reasons, one of the most recent and important issues on which the industry has concentrated with point-of-use filtration is the protection of lens and other optical elements in lithography exposure tools. From a technical point of view, increased outputs as well as the higher energy of shorter wavelengths have resulted in increased pollution of optical surfaces. From an economical point of view, the driving forces have been reduction of tool downtime required for cleaning of optical parts and improvement of yield rates. The spectrum of gas phase contaminants to be controlled has increased while acceptable levels for species such as SOx, NOx, Si-based components, DiOctylPhtallate , Cl-,… are now well below 1µg/m2. As shown in Fig. 1, in addition to the lens, where point-of-use filtration has been used for many years, the wafer and reticle stages, and the illuminator system are new examples of zones that can benefit from protection with point-of-use filters. In each zone, environmental conditions or physico-chemical characteristics of the air or gas stream can be very different. Filter efficiency depends on those characteristics which dictate the choice of filtration media and the filter's overall design. As an example, at the wafer level the chemical filter must remove gas phase basic, acidic and organic contaminants in the presence of moisture (typically 50% relative humidity); however, at the reticle stage and within the illuminator, gas phase contamination control has to be achieved in an environment (compressed air or compressed nitrogen) that has extremely low levels of humidity (<-70ºC dew point). A comparative study of the behaviour of chemical filtration media in varying conditions of temperature, pressure and relative humidity is essential to select the media best suited to each individual application. Relative humidity has been shown to have a large impact on filtration performance1.

Humidity levels In high relative humidity conditions, physical adsorption of activated carbons is often reduced, the adsorption of water having a negative impact on its capacity for organics. This must be compensated for by careful selection of carbon material or modifications to the carbon surface. For the removal of basic and acidic species, high relative humidity levels enhance the chemisorption filtration mechanism of chemically impregnated carbon, while at extremely low levels of water content (dew point <-70°C) removal efficiency is reduced making other media such as ion exchange better suited. For each specific application, it becomes essential to select or combine different media to cover the range of contaminants of concern. Clean dry air used for air bearings in critical process areas, nitrogen or clean air used for purging optical elements in lithography tools are examples of point-of-use filtration that help address today's technology's challenges. Field tests have shown contamination levels of basic, acidic and organic contaminants downstream of these filters to be below detection limits of 0.1ppb. Another area of interest is the protection of reticles (Fig. 2): similarly to disk drive and sensor applications where breathers are used for protection against particulate contamination, moisture or acid gas contaminants, current pellicle frames protecting the reticles are fitted with breather membranes. So far, these membranes are for particulate filtration only while chemical contamination issues of reticles, sometimes causing killer defects, are increasingly observed with the move to 193nm lithography and to 300mm wafers2. A possible solution is a breather membrane ensuring chemically clean, as well as particulate-free air, in the semi-closed environment between reticle and pellicle frame. Solutions similar to those developed for the disk drive industry may be of use.

Conclusion Adopting point-of-use filtration within lithography exposure tools has solved severe contamination problems with efficient and cost-effective solutions. Given the variations in environmental conditions of air or gas flows in different locations, specific combinations may be required for each application. Reticle contamination issues, with breather membrane solutions, are also being investigated. At the cleanroom level, the move from Class 1 to SMIF environments, with tighter air purity requirements, also brings chemical contamination challenges that will have to be tackled with point-of-use solutions.

Paul Vannerem, Donaldson Europe Tel. : +32 16 38 39 83 email: pvannere@mail.donaldson.com

You may also like