Chip manufacturer Taiwan Semiconductor Manufacturing Co (TSMC) has held a groundbreaking ceremony for the fifth phase of its Fab 14 gigafab at the South Taiwan Science Park in Tainan, Taiwan.
The new facility will be TSMC’s second 20nm fab area, scheduled to begin volume production in early 2014.
TSMC’s Phase 6 at Fab 12 in Hsinchu, coming on stream next year, will be the first fab area to manufacture on 20nm for TSMC. The Fab 14 Phase 5 facility will be combined with the planned Phase 6 to offer a total cleanroom area of 87,000m2, the equivalent of more than 11 football pitches and four times larger than a typical 12in fab, TSMC said.
Fab 14 is TSMC’s second 12in fab following Fab 12. Phase 1 began volume production in 2004. With Phases 1–4 now in operation with an estimated value of US$6bn, Fab 14 has a capacity of 500,000 12in wafers each quarter.
The firm expects the combined annual revenue of Phases 5 and 6 to reach a similar scale.
Around 4,600 people are currently employed at Fab 14 and the expansion will create another 4,500 jobs, the semiconductor firm said.
Dr Morris Chang, TSMC’s chairman and chief executive, said TSMC would continue to invest in Taiwan.
“Our mission is to be the trusted technology and capacity provider of the global logic IC industry for years to come,” he said.
“This groundbreaking for Fab 14, Phase 5 represents TSMC’s capability to develop leading-edge technology, build advanced capacity, and satisfy customer demand. It also lays the foundation for TSMC’s next wave of growth.”