The Antares removes nanoscale particles from wafers
FSI International Inc says several leading device producers, including a new fab, have placed orders for Antares CryoKinetic Cleaning Systems. Chip providers currently use the system for various back-end-of-line (BEOL) particle removal processes and front-end-of-line (FEOL) advanced node applications as they look to improve yields.
The Antares system is a fully automated, single-wafer, CryoKinetic system used for processing 200/300mm wafers with capabilities to remove nanoscale particles.
CryoKinetic processing technology is an all-dry, chemical free process that removes particles through impact by high-velocity cryogenic Ar/N2 aerosol, and reduces defects without damaging the wafer surface, even on copper and porous low-k films. The systemís highly efficient dry cleaning solution can be used for a variety of particle removal applications in FEOL and BEOL.
Many of the leading logic device manufacturers worldwide utilize the system for its defect reduction and yield improvement benefits at current leading edge technology nodes.