TSMC has announced its intention to build and operate an advanced semiconductor fab in the US with the mutual understanding and commitment to support from the US federal government and the State of Arizona.
This facility, which will be built in Arizona, will utilise TSMC's 5-nanometer technology for semiconductor wafer fabrication, have a 20,000 semiconductor wafer per month capacity, create over 1,600 high-tech professional jobs directly, and thousands of indirect jobs in the semiconductor ecosystem.
Construction is planned to start in 2021 with production targeted to begin in 2024. TSMC's total spending on this project, including capital expenditure, will be approximately $12 billion from 2021 to 2029.
The company says that this US facility not only enables it to better support customers and partners, it also gives it more opportunities to attract global talents.
"This project is of critical, strategic importance to a vibrant and competitive US semiconductor ecosystem that enables leading US companies to fabricate their cutting-edge semiconductor products within the US and benefit from the proximity of a world-class semiconductor foundry and ecosystem," TSMC said in a press release.
"This project will require significant capital and technology investments from TSMC. The strong investment climate in the US, and its talented workforce make this and future investments in the US attractive to TSMC. US adoption of forward-looking investment policies to enable a globally competitive environment for a leading edge semiconductor technology operation in the US will be crucial to the success of this project. It will also give us the confidence this and other future investments by TSMC and its supply chain companies will be successful," the statement added.
In the US, TSMC currently operates a fab in Camas, Washington and design centres in both Austin, Texas and San Jose, California. The Arizona facility would be TSMC's second manufacturing site in the US.