Will invest up to US$8bn in fab and upgrades to manufacturing processes for semiconductors
Intel Corporation is to invest US$6–US$8bn on new manufacturing processes and on the construction of a semiconductor fab in its US facilities.
The US chipmaker is to deploy its next-generation 22nm manufacturing process across several US factories, and build a new development fabrication plant (fab) in Oregon.
The projects will support up to 8,000 construction jobs and create 800–1,000 new high-tech jobs.
“The most immediate impact of our multi-billion-dollar investment will be the thousands of jobs associated with building a new fab and upgrading four others, and the high-wage, high-tech manufacturing jobs that follow,” said Intel president and chief executive Paul Otellini.
The upgraded fabs will create capacity for the continued growth of the PC and additional computing markets addressed by Intel, such as mobile and embedded computing.
The new fab in Oregon – to be called D1X – is scheduled for r&d start-up in 2013. Upgrades are also planned for four existing Intel factories in Arizona (known as Fab 12 and Fab 32) and Oregon (known as D1C and D1D).
“Intel makes approximately 10 billion transistors per second. Our factories produce the most advanced computer technology in the world and these investments will create capacity for innovation we haven’t yet imagined,” said Brian Krzanich, senior vice president and general manager of Intel’s Manufacturing and Supply Chain.
While Intel generates approximately three-quarters of its revenues overseas, it maintains three-quarters of its microprocessor manufacturing in the US.
This new capital expenditure follows Intel’s announcement in February 2009 to support state-of-the-art upgrades to its manufacturing process. Those upgrades resulted in 32nm process technology, which has already produced computer chips being used today in PCs, servers, embedded and mobile devices around the world.
Intel’s first 22nm microprocessors, codenamed “Ivy Bridge,” will be in production in late 2011 and will boost performance and power efficiency. By continuing to advance manufacturing process technology, additional features and functions can be integrated, leading to devices with sleeker designs, higher performance and longer battery life plus lower costs for users.