The Austria facility has combined EV Group's wafer and lithography offerings, as well as pilot-line production facilities and services, at its headquarters
Cleanroom facilities in the Heterogeneous Integration Competence Center
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has established the Heterogeneous Integration Competence Center, which is designed to assist customers in leveraging EVG's process solutions and expertise to enable new and enhanced products and applications driven by advances in system integration and packaging.
These include solutions and applications for high-performance computing and data centres, the Internet of Things (IoT), autonomous vehicles, medical and wearable devices, photonics and advanced sensors.
The Heterogeneous Integration (HI) Competence Center combines EVG's wafer bonding, thin-wafer handling, and lithography products and expertise, as well as pilot-line production facilities and services at its state-of-the-art cleanroom facilities at EVG's headquarters in Austria, supported by EVG's worldwide network of process technology teams.
Markus Wimplinger, Corporate Technology Development & IP Director said: "EVG's new HI Competence Center provides an open-access innovation incubator for our customers and partners across the microelectronics supply chain to collaborate while pooling our solutions and process technology resources to shorten development cycles and time to market for innovative devices and applications enabled by heterogeneous integration."